| 摘要 |
<p>PURPOSE:To prevent an organic substance from adhering to a vacuum suction route by a method wherein a vacuum suction operation is executed not only during a removal treatment of the organic substance but also during nontreatment such as a wafer conveyance operation, during a standby state or the like. CONSTITUTION:A wafer 1 is placed on a stage 2 and is vacuum-sucked by means of a vacuum suction route 3. A mixed gas of ozone and oxygen is introduced from a nozzle 4 and, in addition, ultraviolet rays are radiated from an ultraviolet lamp 5 to remove a resist on the wafer 1. After that, the wafer 1 is unloaded, an untreated wafer 1 is loaded. Even during a nontreatment time for this unloading and loading operation, a vacuum suction operation is executed by means of the vacuum suction route 3, the air is made to flow inside a treatment chamber 10 and the vacuum suction route 3 is cleaned. Also during the nontreatment time, i.e., during a standby time, the route 3 may be cleaned by executing the vacuum suction operation. When a reaction gas such as the mixed gas of ozone and oxygen or the like is made to flow the treatment chamber 10, a cleaning operation can be executed effectively.</p> |
