| 摘要 |
A laser diode module comprises a rectangular, box-like metal casing having a bottom (B), whereas an even number of guide pins (1-14) are passed through the bottom (B) in a standardized DIL order and no less than one guide pin (5) is electroconductively connected to the bottom (B). In addition to the laser diode (LD) itself the module further includes a Peltier cooler (TEC) and a thermal metal base carrier (BC) coupled thereto, which base carrier accommodates the laser diode (LD), a photodiode (PD), a support (S) for the glass fibre (F) and a thermistor (TH). In order to render this laser diode module suitable for use in communication systems with bit rates that exceed by far 1 Gbit/s, the said guide pin (5) has inside the casing a portion in the form of a rod with a constant cross-section and with no less than one flat side face which over its entire surface has an electroconductive coupling with the relevant long sidewall (SW1) of the casing, an electroconductive interconnecting strip being provided between the head face of the rod and the base carrier (BC) |
