| 摘要 |
PURPOSE:To make an X-ray extraction window large without making the material thick by a method wherein the material for the X-ray extraction window is reinforced with a reinforcement frame occupying a position corresponding to a shutoff part of an X-ray exposure mask. CONSTITUTION:A reinforcement frame 7 used to reinforce an X-ray extraction window material 10 is arranged on the surface side of the X-ray extraction window material 10. In the reinforcement frame 7, through holes 8 are made in individual parts corresponding to semiconductor chips formed on a semiconductor wafer 16; X rays 2 can be passed there. The reinforcement frame 7 occupies only parts corresponding to scribing lines of the semiconductor wafer 16. A positioning operation is executed in such a way that the individual through-holes 8 of the reinforcement frame 7 correspond to the individual semiconductor element chips and that the reinforcement frame 7 corresponds to shutoff parts corresponding to scribing lines of an X-ray exposure mask 12. Consequently, an exposure area can be made wide without making the X-ray extraction window material 10 thick. |
