SEMICONDUCTOR PACKAGING MODULE AND COOLING STRUCTURE

摘要

PURPOSE:To improve lubricating characteristics without destroying heat transfer characteristics of cooling structure by forming a fluorine thin film lubricating layer which is formed at each heat transfer surface or at a part of the heat transfer surface in a prescribed thickness. CONSTITUTION:A great amount of heat that is generated by a semiconductor element 2 is transferred by making contact from the base 9 of a heat transfer intermediate block 3 which is in contact with the rear of the element 2. A heat transfer block 6 has a V-shaped groove that is equal to a projection shape of the block 3. Having a flat plane, one side of the V-shaped groove comes into contact with the cylindrical upper face 10 of the block 3. Heat transferred to the block 3 is transmitted to the flat plane of the V-shaped groove from the cylindrical upper face 10 of the block 3. A fluorine thin film lubricating layer 13 is provided at the whole body of cooling structure or at the above block 3 by a thin film lubricating layer. The thin film of fluorine-type lubricating layer is thus either of a fluorine-contained compound having an ordinary greese like lubricating agent and a silanol group at the terminal or an organic film which contains a fluorine-containing compound at the surface. However, it is necessary for respective film thicknesses to be thinner than 5mum or less in order to minimize heat resistance to the utmost.