发明名称 A device for heat treatment using vapour (steam) at reduced pressure
摘要 A device for heat treating, using steam at reduced pressure, directly or indirectly, a material or product to be heat-treated, which includes a heat-exchange chamber which is supplied with steam via a pressure- reduction valve and evacuated by means of an ejector device which can control the heating temperature of the heat-exchange chamber by means of the control of the working fluid of the ejector device. The device may be used as a safety device and, advantageously, in the chemicals and food industries.
申请公布号 ES2018433(A6) 申请公布日期 1991.04.01
申请号 ES19890004072 申请日期 1989.11.29
申请人 TLV COMPANY, LIMITED 发明人 MORII TAKAYUKI;YUMOTO HIDEAKI
分类号 F24H9/20;(IPC1-7):F24H9/20 主分类号 F24H9/20
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