The present invention removably mounts a plurality of solid state devices and a circuit board to a chassis heat sink by utilizing a heat conductive device formed with a base and a leg portion with the leg portion extending from the base and having a first relatively flat surface and an angled end position. The base of the device is adapted to be mounted to a chassis heat sink and the relatively flat surface is adapted to contact one side of each of the plurality of solid state devices. A number of cap members having an inverted L-shaped cross section, with first leg portions and second leg portions are provided with an angled surface for mating with the angled end portion such that the first leg portions are substantially parallel to the first relatively flat surface. A fastener member is provided for urging the first leg portions of the cap member toward the first relatively flat surface for sandwiching the plurality of solid state devices in thermal contact with the heat conductive device and the number of cap members.
