Multi-chip module - with chips carried in book page fashion by specified plastic coating

摘要

A multi-chip module of indivual VLSI/ULSI chips, e.g. memories or processors, has the individual chips joined to a horizontal wall, carrying the conductor tracks, by thin ribs of flexible material. All chips stand on edge relative to the wall and can thus be handled like the turned-over pages of a book. The flexible lining is made of polyimide, produced by a dip-and-suction technique. A horizontal wall (1) which ultimately carries conductor tracks (26) and the chips (10) for the conductor tracks (24) are pref. coated by a lining of polyimide (20), joined by vertical ribs (15). For the photolithographic operation the chips can be inclined like the pages of a book. The metallic connections between the conductor tracks are also indicated (25). ADVANTAGE - This permits a higher packing density, yet gives adequate access for photolithographical techniques.