| 摘要 |
<p>PURPOSE:To automate inspection of electric characteristics by a method wherein a plurality of semiconductor chips are pressed into specific positions on a substrate and they are carried and positioned while they are mounted on the substrate. CONSTITUTION:An upper plate 5 is slid toward a lever 6 by operation of the lever 6 in advance, and with a pressing member 12 of each pressing mechanism 10 moved to a release side, each semiconductor chip 7 is mounted on a conductive rubber plate 15 of each positioning mechanism 8. When the lever 6 is operated to slide the upper plate 5 opposite to the lever 6, the pressing member 12 of each pressing mechanism 10 applied with force by a coil spring 11 moves toward pressing side so as to press each semiconductor chip 7 against a positioning block 9. This chip tray is carried, and then it is positioned by recognizing a recognition line 2 on a substrate 1 with an image recognizing device or the like. An inspecting terminal is brought into contact with an electrode 7b provided above the semiconductor chip 7 from above to obtain electrical conductivity, and further the inspecting terminal is brought into contact with the conductive rubber plate 15 from above. Thus electrical conductivity with an electrode 7a provided under each semiconductor chip 7 can be obtained and inspection of characteristics can be automated.</p> |
