| 摘要 |
Mfr. of a module for electronic equipment, esp. hearing aids, involves (a) stacking and interconnecting two or more ICs (1,2) which form the module; (b) mounting the assembly on a carrier (3) (e.g. of polyimide), which has electronic devices (5) and circuit lines (4) on at least one side; (c) electrically connecting the circuit liner and the IC connectors (6); and (d) folding the carrier (3) by 180 deg. about one or more fold lines (7,8) to form a module (9) with free connection leads. ADVANTAGE - An extremely compact module, with high mfd. quality and extremely low reject rate, is produced in a simple manner.
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