发明名称 MODULE FOR OPTICAL COMMUNICATION
摘要 PURPOSE:To offer a light transmission module which can be packaged in a small size and allows easy assembly by consisting the module of a wiring board packaged with an ic for optical transmission and an ic for optical reception on the respectively opposite surfaces of the board, two resin members which hold these ics in a sandwich form and an external case. CONSTITUTION:The packaged substrate 21 is mounted with the ic 23 for optical transmission and other parts 24 on one surface of the wiring board 22 and is mounted with the ic 25 for optical reception and the peripheral parts 26 thereof on the other surface. A taper is provided on a projecting part 42 of an upper spacer and a taper on a lower spacer 27. Since a side face 41 of the lower spacer has elasticity, the lower spacer can be housed into a lower case by a snap action. The upper spacer can be housed into the lower spacer by the effect of a cushion member 29 and the taper.
申请公布号 JPH0371102(A) 申请公布日期 1991.03.26
申请号 JP19890206763 申请日期 1989.08.11
申请人 HITACHI LTD 发明人 KUSANO MASAAKI;KOAKUTSU YASUMASA
分类号 G02B6/42;H01L33/00 主分类号 G02B6/42
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