| 摘要 |
<p>PURPOSE:To dispense with the removal of needless resin by equipping an insulating film, which has a pair of outer leads divided respectively and a pair of center the bars to become the flow passages of fused resin, and a plurality of leads, which are supported on the lead support part of the insulating film and whose one end projects to an opening. CONSTITUTION:For a semiconductor chip 2 where a plurality of bump electrodes 21 are formed at the surface, these are connected electrically by thermocompression-bonding the bump electrode 21 with the inner lead 4a. Hereby, a tape carrier is formed. A tape carrier is set between an upper mold 10c and a lower mold 10d, and the upper mold 10c and the lower mold 10d are closed, and fused resin 11 is injected through gates 131 and 132 into cavity being formed. Since the widths of the groove-shaped gates 131 and 132 formed in the upper mold 10c are narrower than the widths of the center tie bars of the carrier tape, when the upper mold 10c and the lower mold 10d are closed, for each gate 131 and 132, the lower part is closed by the center tie bars 91 and 92, and it becomes tubular shape. Accordingly, the resin 11 never invades the outer lead hole 5 of the carrier tape.</p> |
