发明名称 |
Polyamide base binder for use in metal powder injection molding process |
摘要 |
A polyamide binder for use in injection molding a metal powder comprising in combination: (a) 40 to 50 wt % of a polyamide resin component having an average molecular weight of not less than 20,000 and prepared by co-polycondensation of a mixture of dimer acid, azelaic acid, ethylenediamine and xylylenediamine each being mixed in a substantially equal molecular equivalent ratio; (b) 20 to 30 wt % of ethylene-bis-laurylamide; and (c) the balance of N,N-diacetylpiperazine.
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申请公布号 |
US5002988(A) |
申请公布日期 |
1991.03.26 |
申请号 |
US19890379604 |
申请日期 |
1989.07.13 |
申请人 |
SANWA CHEMICAL INDUSTRY CO., LTD. |
发明人 |
ONO, HIROSHI;SAITOH, KATUYOSHI;YAGAMI, HARUO;SAIKI, TAKEO;MASUDA, YOSHIMICHI |
分类号 |
C08L77/00;B22F1/00;B22F3/02;B22F3/22;C08K5/20;C08K5/3462 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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