| 摘要 |
There is disclosed a liquid cooled high power semi-conductor structure comprising multiple stacked semi-conductor devices each having at least one surface prepared with a heat transfer surface having a low thermal resistance whereby heat generated in said semi-conductor device may be readily transported through said opposing heat transfer surface to a liquid coolant, there further being a conduit for the directing of the flow of said coolant, there being multiple semi-conductor devices stacked with heat exchange surfaces of adjacent or semi-conductor devices opposing each other, said heat exchange surfaces being spaced apart to form a coolant conduit, the several coolant conduits being fed coolant in parallel by a common input conduit and the discharge coolant feeding in parallel into a common discharge conduit, said stacked semi-conductor devices being electrically connected in series or some combination of series parallel.
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