| 摘要 |
<p>PURPOSE:To reduce static electricity caused mainly by an adhesive sheet and to reduce its influence on a semiconductor substrate by a method wherein the adhesive sheet is provided with a conductivity. CONSTITUTION:In a resin-based or polymer-based adhesive sheet 1, for semiconductor device manufacturing use, which is used so as to be pasted on a semiconductor substrate 3 during a manufacturing process of a semiconductor device, the adhesive sheet 1 is provided with conductivity. For example, a film sheet provided with conductivity of 10<8> to 10<12>OMEGAcm is used as said adhesive sheet 1. A resin sheet containing a conductive substance, a film sheet of polymer structure which is provided with conductivity in itself, or the like, is used as such a film sheet. For example, the film sheet 1 is put between a pressure roller 2 and the semiconductor substrate 3. While the pressure roller 2 is turned gradually, the film sheet 1 is pasted on the surface of the semiconductor substrate 3.</p> |
