| 摘要 |
<p>PURPOSE:To gain extremely high dielectric breakdown strength between the light emitting side and the photosensitive side by attaching a light emitting element and a photosensitive element opposite each other to both sides of a light transmitting insulating plate. CONSTITUTION:A light emitting element 4 is attached to one side of a light transmitting insulating plate 1 with its light emitting side facing the light transmitting insulating plate 1. A photosensitive element 7 is attached to the other side of the light transmitting insulating plate 1 with its photosensitive side opposite the light emitting element 4. For example, the light emitting element 4 is connected to a wiring 2 provided to one side of the quartz glass plate 1 by solder 3 and attached thereto with its light emitting side facing the quartz glass plate 1. The photosensitive element 7 is connected to wiring 5 provided to the other side of the quartz glass plate 1 by solder 6 and attached thereto with its photosensitive side opposite the light emitting element 4. A photocoupling element of high dielectric breakdown strength is formed by sealing with light screening resin, while containing the light emitting element 4 and the photosensitive element 7.</p> |
