| 发明名称 |
EPOXY RESIN COMPOSITION |
| 摘要 |
EPOXY RESIN COMPOSITION A water resistant epoxy resin composition is disclosed, said composition comprising an epoxy resin, a compound having at least two phenolic hydroxyl groups sufficient to cure the epoxy resin component, an aromatic nitrogen-containing silane coupling agent and an inorganic filler. The epoxy resin composition is well suited for use as a sealant for electronic components.
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| 申请公布号 |
CA2025707(A1) |
申请公布日期 |
1991.03.22 |
| 申请号 |
CA19902025707 |
申请日期 |
1990.09.19 |
| 申请人 |
DOW CORNING TORAY SILICONE COMPANY, LTD. |
发明人 |
ENAMI, HIROJI;IMAI, TAKESHI |
| 分类号 |
C08L63/00;C08G59/00;C08G59/62;C08K5/5435;C08K5/544;C08K5/549;C08K13/02;H01L23/29;H01L23/31;(IPC1-7):C08L63/00;C09D163/00;C09D5/34 |
主分类号 |
C08L63/00 |
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