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发明名称
METHOD FOR TEMPORARILY SEALING HOLES IN PRINTED CIRCUIT BOARDS
摘要
申请公布号
AU608186(B2)
申请公布日期
1991.03.21
申请号
AU19870081676
申请日期
1987.11.25
申请人
MULTITEK CORPORATION
发明人
EDWARD J. CHOINSKI
分类号
H05K3/06;H05K3/00;H05K3/34;(IPC1-7):H05K3/22
主分类号
H05K3/06
代理机构
代理人
主权项
地址
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