| 摘要 |
<p>An electrostatic handling device (10) for a wafer (40) having a pair of faces (41, 42), includes a dielectric region (20) having a top face (21) which is adapted to accept one of the pair of wafer faces (41, 42) thereagainst. Conductors (30) are positioned in the dielectric region (20). The conductors (30) are arranged in the dielectric region (20) to generate electrostatic force between the conductors (30) and the wafer (40) to hold the wafer (40) against the top face (21) of the dielectric region (20). The conductors (30) are further arranged in the dielectric region (20) to generate substantially no net electrostatic force at the opposite one of the pair of wafer faces (41, 42) to thereby reduce electrostatic force interference thereat.</p> |
