| 摘要 |
PURPOSE:To form a high-reliability bump quickly, easily and at a low cost by a method wherein a ball part formed at a tip part of a wire by a fusing operation is bonded to an electrode pad by a ball bonding treatment and, after that, the ball part is cut off from the wire to form the bump. CONSTITUTION:An electrode 7 for electric discharge use is brought close to a tip part of a wire 6 of Al, Au or the like which has been pierced through and held in a capillary 5; an electric discharge is caused between both; the tip part of the wire 6 is fused to form a ball part 6a. Then, the electrode 7 for electric discharge use is retreated; after that, the ball part 6a is pressed to one electrode pad 1 on a semiconductor chip 2 by lowering the capillary 5; the ball part 6a is bonded and united to the electrode pad 1 by applying heat or ultrasonic vibrations. Then, the capillary 5 is moved in a transverse direction or a bonding stage 4 is moved in the transverse direction to cut the ball part 6a from a root of the wire 6. Thereby, a bump 8 in which the ball part 6a has been united to the electrode pad 1 is formed. |
