| 摘要 |
PURPOSE:To facilitate a bonding of an easily oxidative metal and to suppress entrance of a reaction product to a connecting point by a method wherein a wire is bonded by an ultrasonic bonding method in a vacuum atmosphere and moreover, the wire subsequent to the bonding is cut using a charged corpuscular beam. CONSTITUTION:When a wire 1 is brought into contact to a material 2 to be bonded while ultrasonic vibrations are applied to the wire 1 through a horn 10, both are rubbed to each other, oxide films 3 of both are broken by friction and clean surfaces 4 appear. At this time, if the amount of atmospheric gas is 1X10<-8>Pa or thereabouts, the volume of a bonding space is 10l and the area of each clean surface is 50mum mphi or thereabouts, a layer consisting of a reaction product becomes only a 0.5 to 1 molecular layer even if the total amount of the reaction product is generated on the clean surfaces and the dirt of the clean surfaces is very little. By further applying ultrasonic vibrations, the fellow clean surfaces are rubbed, part of each clean surface is fused, then, the clean surfaces are pressure welded to each other by an applying pressure and the bonding of the wire to the material 2 to be bonded is completed. The bonded wire 1 is fused and cut by irradiating and electron beam 15 from an electron beam source 14. |
