| 摘要 |
<p>PURPOSE:To form a high-reliability bump quickly, easily and at a low cost by a method wherein a conductive paste on an electrode part of an interconnection pattern formed on a board for mounting use and an electrode pad part of a semiconductor chip is bonded and united to the bump on the board for mounting use. CONSTITUTION:By moving a squeegee 7, a conductive paste 6 is transcribed and coated on discrete electrode parts 2a at tips of interconnection patterns 2 through a bump pattern 5. By this screen-printing operation, bumps 8 are formed on the respective electrode parts 2a. As a thickness of the bums 8, a sufficient thickness which prevents a semiconductor chip 9 from coming into contact with an overglaze 3 and the electrode parts 2a is secured when the semiconductor chip 9 is mounted in a posterior process. A plurality of electrode pad parts 13 on the semiconductor chip 9 are aligned with the discrete bumps 8 on the side of the board 1 for mounting use and are pressed strongly; ultrasonic vibrations are exerted on a bonding tool 10. Thereby, the electrode pad parts 13 are bonded and united to the electrode parts 2a via the bumps 8 by a thermosonic method.</p> |
