| 摘要 |
An electrostatic handling device for a wafer having a pair of faces, includes a dielectric region having a top face which is adapted to accept one of the pair of wafer faces thereagainst. Conductors are positioned in the dielectric region. The conductors are arranged in the dielectric region to generate electrostatic force between the conductors and the wafer to hold the wafer against the top face of the dielectric region. The conductors are further arranged in the dielectric region to generate substantially no net electrostatic force at the opposite one of the pair of wafer faces to thereby reduce electrostatic force interference thereat.
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