| 摘要 |
PURPOSE:To improve the adhesive properties without degrading the mechanical properties, heat resistance, etc., of a para-oriented arom. polyamide film by bringing the film contg. water or an org. solvent into contact with a liq. contg. an epoxy compd. and heat-drying the film under controlled shrinkage. CONSTITUTION:An optically anisotropic dope contg. a para-oriented arom. polyamide (e.g. poly-p-phenyleneterephthalamide) having a logarithmic viscosity of at least 2.5 and a solvent such as conc. sulfuric acid, chlorosulfuric acid, fluorosulfuric acid, etc., of at least 95wt.% concn. is cast on a substrate surface while the optical anisotropy is kept unchanged, allowed to stand until it turns into an optically isotropic dope by moisture absorption and(or) heating, coagulated, and freed of the solvent, thus giving a film contg. at least 50wt.% water or(and) org. solvent. The resulting film is brought into contact with a liq. contg. an epoxy compd. (e.g. a modified bisphenol A epoxy resin), and dried at 50 deg.C or higher under controlled shrinkage to produce a para-oriented arom. polyamide film having improved adhesive properties. |
