发明名称 |
Facing targets sputtering device |
摘要 |
A Facing Targets Sputtering device for making a thin film comprises: a pair of targets with magnets placed at opposite positions within a container so as to face each other so as to maintain a space for a plasma region; and first and second power sources respectively connected to the both targets and being controllable independently from each other, so that electric energies supplied to the targets can be independently controlled. Therefore, the composition of the thin film can be readily selected and controlled even during operation.
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申请公布号 |
US5000834(A) |
申请公布日期 |
1991.03.19 |
申请号 |
US19890405818 |
申请日期 |
1989.09.08 |
申请人 |
PIONEER ELECTRONIC CORPORATION |
发明人 |
YOSHIKAWA, TAKAMASA |
分类号 |
C23C14/34;C23C14/35;C23C14/54;G11B7/26;G11B11/10;G11B11/105;H01J37/34 |
主分类号 |
C23C14/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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