| 摘要 |
<p>PURPOSE:To obtain an adhesive tape for holding semiconductor wafers having a fixed releasable property by making a bonding agent to have minute cylindrical projections at regular intervals on a plastic sheet. CONSTITUTION:A plastic sheet 1 is coated with cylindrical bonding agent layers 2A formed at regular intervals. An IC piece 3 divided from a thin semiconductor wafer is stuck to part of the adhesive layers 2A. Namely, the IC piece is made to hardly receive the influence of the fluctuation of adhering strength of the bonding agent as compared with the conventionally used adhesive tape to which an IC piece is fully stuck by the entire surface by partially sticking the IC piece to this adhesive tape. Moreover, the adhering strength of IC pieces having difference sizes can be set arbitrarily and fixed releasable properties can be obtained to the IC pieces, because the adhering area with the IC pieces can be changed easily when the interval of the cylindrical adhesive layers is changed.</p> |
