| 摘要 |
<p>PURPOSE:To obtain a highly crack-resistant organic thick film resistor with high adhesion to a substrate by performing defoaming at a lower temperature than the hardening initiation temperature of paste matrix resin before initial hardening with far infrared radiations. CONSTITUTION:Organic thick film resistor paste is applied to a resin substrate and defoamed before initial hardening with far infrared radiations. That is, the resistor film applied to the substrate is defoamed by exposing the substrate to an atmosphere at a little high temperature and lowering the viscosity of the paste. In defoaming in a high-temperature atmosphere, the desirable temperature range is 35-60 deg.C, within which the viscosity of paste matrix resin is lowered and which is lower than the hardening initiation temperature thereof.</p> |
