| 摘要 |
<p>PURPOSE:To reduce the diameter of a lead pin, and realize high density mounting, by performing boring process after the baking of a substrate, and inserting the lead pin into a hole. CONSTITUTION:A semiconductor chip 2 is die-bonded on the central part of the main surface of a base substrate 1, and a heat dissipating fin 3 is fixed. The substrate 1 is superposed on a recess-shaped cap substrate 5 via soldering parts 4, and the chip 2 is packaged so as to position at the recessed part of the substrate 5. Fine holes are formed at specified parts of the substrate 5 by boring process, and lead pins 7 are inserted into the holes. The lead pins are directly connected with the soldering parts 4, so that the pins 7 electrically come into contact with the chip 2 on the substrate 1 via the soldering parts 4.</p> |
