发明名称 |
WERKWIJZE VOOR HET REGELEN VAN DE SAMENSTELLING VAN EEN CHEMISCHE KOPERBEKLEDINGSOPLOSSING. |
摘要 |
The pH of a chemical copper plating solution is exactly measured for a prolonged time by utilizing a copper oxide prepared by etching metallic copper in an 0.1-1 N inorganic acid then oxidizing the etched metallic copper in an aqueous 0.1-1 N alkali metal hydroxide solution as a main electrode for pH measurement or reducing agent concentration measurement in terms of pH. A combination of the pH measurement with well known procedures for measuring concentrations of cupric ions and a complexing agent exactly measures the pH and the concentrations of a reducing agent, cupric ions and a complexing agent for a continuation of longer time than the conventional procedures. |
申请公布号 |
NL187325(B) |
申请公布日期 |
1991.03.18 |
申请号 |
NL19800005140 |
申请日期 |
1980.09.12 |
申请人 |
HITACHI LTD. TE TOKIO, JAPAN. |
发明人 |
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分类号 |
G01N27/333;C23C18/16;G01N27/30;G01N27/416;(IPC1-7):G05D21/00 |
主分类号 |
G01N27/333 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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