| 摘要 |
PURPOSE:To make possible an adhesion of the bonding regions of printed boards onto a carrier by a method wherein through holes are provided in the carrier, on which the printed boards are placed and transferred, the through holes communicate with the opening of a heater block and the printed boards are held by suction. CONSTITUTION:A plurality of boards 2 to be wire bonded are placed and transferred on a carrier 1 of a wire bonding device. A plurality of through holes 4 are provided in this carrier 1 corresponding to a bonding pattern and the holes 4 communicate with an opening 7 of a heater block 6. Moreover, bonding regions of the boards 2 are reliably adhered and fixed on the carrier 1 two- dimensionally by vacuum suction through the opening 7 and a good wire bonding is executed to the flexible boards as well. |
