| 摘要 |
PURPOSE:To prevent electrical discontinuity between a wire and a pad by forming an oxide aluminum layer by oxidizing an aluminum surface excepting a joint section between a bonding pad surface and a bonding wire and a section covered with a cover film and by forming an oxide aluminum layer. CONSTITUTION:After connected by a bonding wire 6, a semiconductor substrate 1 and a package are oxidized for about one hour at 400 deg.C in an oxygen atmosphere. Then, a surface of an exposed aluminum turns to aluminum oxide 5. Thereby, when water enters from an outside of a semiconductor device along a bonding wire, water and phosphorus element in the semiconductor substrate are prevented from reacting to turn to phosphoric acid and fusing a bonding pad to electrically disconnect a bonding wire and a semiconductor device. |
