Package in the heat dissipation of Electronic devices,申请号US19890300882-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	Package in the heat dissipation of Electronic devices
摘要
申请公布号	US4999741(A)	申请公布日期	1991.03.12
申请号	US19890300882	申请日期	1989.01.24
申请人	THE GENERAL ELECTRIC COMPANY, P.L.C.	发明人	TYLER, STEPHEN G.
分类号	H05K3/28;H05K5/00	主分类号	H05K3/28
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Process and device for producing a chilled dessert item containing a crunchy composition arranged in superimposed layers in its mass

Instantaneous panning using a groove metaphor

Managed pressure cementing

Apparatus for manufacturing molten metal

Fire ignition system

Stable heterodimeric antibody design with mutations in the Fc domain

Electrically driven vehicle

Insect repelling methods and compositions

Attachment arrangement for composite wheels

Dual variable domain immunoglobulins and uses thereof

Novel fused heterocyclic derivatives useful as c-Met tyrosine kinase inhibitors

Proxy authentication methods and apparatus

Use of a composition comprising an antimicrobial peptide as a food preservative

Dosing and drive mechanism for drug delivery device

Fastening mechanism for a carton

Systems and methods for well monitoring

Surgical forceps

Control mechanism for subsurface safety valve

Compositions and methods for the generation of platelets and methods of use thereof