发明名称 METHOD FOR WORKING PRINTED CIRCUIT BOARD
摘要 PURPOSE:To form a flat shape which has less ruggedness on a worked surface by providing materials which are unified in absorptance to electromagnetic waves to constitute the materials for constituting a printed circuit board. CONSTITUTION:An oxide film 4 is formed on the surface of a copper foil layer 1, by which the absorbance of the copper foil layer 1 is improved. Epoxy is used for the base of a resin layer 2 and fine powder of silica is incorporated therein to suppress the absorbance of the resin layer 2. A material formed by incorporating Fe<3+>, etc., into glass which is a reinforcing material is used for a glass cloth layer 3 to improve the absorbance of IR. The printed circuit board constituted in such a manner can be worked to the flat sectional shape having the less ruggedness in the resulted hole when this printed circuit board is irradiated with a CO2 laser under prescribed conditions. The absorptances of the copper, resin, glass, etc., to wavelength light are uniformized to about the same level at a high level above the prescribed value in such a manner, by which the respective constituting materials are decomposed and evaporated to about the same extent and the worked section having the flat shape with the less ruggedness is obtd.
申请公布号 JPH0357583(A) 申请公布日期 1991.03.12
申请号 JP19890188969 申请日期 1989.07.24
申请人 CANON INC 发明人 INAGAWA HIDEHO;NOUJIYOU SHIGENOBU
分类号 B23K15/08;B23K26/00;B23K26/40;H05K3/00 主分类号 B23K15/08
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