| 摘要 |
<p>PURPOSE:To easily align a bump electrode of a semiconductor chip with a terminal by a method wherein the bump electrode of the semiconductor chip is connected and fixed electrically and mechanically to a substrate by using a magnetic force generated by a superconducting ring and by using a ferromagnetic body. CONSTITUTION:An electric current is made to flow to superconducting rings 3 at a temperature which is higher than a high critical temperature of a superconducting material 7; in this state, the rings are aligned with a substrate 8. The temperature is lowered to a critical temperature of a superconducting material 6; in this state, the materials 6, 7 are both in a superconducting state; consequently, the rings 3 are formed and a superconducting current flows. Even when a power supply is turned off, a loop current flows to the rings 3 and continues to generate a magnetic force. A ferromagnetic body 10 is installed in a position opposite to the rings 3; bump electrodes 2 of a semiconductor chip 1 can be pressure-bonded, connected and fixed electrically and mechanically to a face of interconnection terminals 9 on the substrate 8 by the strong magnetic force generated by the rings 3. Thereby, the electrodes 2 can be aligned easily with the terminals 9.</p> |
