| 摘要 |
PURPOSE:To enhance a moistureproof life during an operation by a method wherein a flange which has been sealed inside a resin body is formed at a peripheral edge of an island so that active ions and moisture are hard to enter. CONSTITUTION:A dish-shaped island 1 which is provided with an element- mounting part in the center and which is provided with a flange 2 having a stepped part at a periphery of the element-mounting part by pressing a peripheral edge part is installed. A semiconductor chip 3 is mounted on the element- mounting part of the island 1; it is sealed with a resin body 4 in a state that only the rear of the element-mounting part is exposed. Since the flange 2 is sealed so as to be wrapped at the inside of the resin body 4, a creeping route of moisture and a contaminant at the island 1 becomes long when the flange is subjected to a thermal stress; it is possible to prevent the chip 3 from being contaminated. Thereby, a moistureproof life can be enhanced when a semiconductor device is operated. |
