发明名称 CHIP TYPE ELECTRONIC PART AND MANUFACTURE THEREOF
摘要 PURPOSE:To obtain a chip type electronic part combining miniaturization and excellent productivity by surface-treating the surface layer of a metallic electrode composed of a flame coating metal formed onto the outer surface of a part body by a solution into which a specific substance is mixed. CONSTITUTION:The surface layer of a metallic electrode 2 consisting of a flame coating metal shaped onto the outer surface of a part body 1 is surface- treated by a solution in which at least one kind or more of substances in a group A mentioned below and at least one kind or more of substances in a group B are mixed. Where there are CH2(OH)COOH, HOOCCH2, CH(OH)COOH and HCl in said group A and there are alkylphenyl polyoxyether, (CH3)2CHOH, n-C4H9OC2H4OH and H2O in the group B. Accordingly, the state of the joining of solder and an electrode at a time when an electronic part is soldered onto a circuit board is improved, and reliability as the circuit board is ensured while the method can contribute to the miniaturization of an electronic equipment and the enhancement of the productivity of the circuit board.
申请公布号 JPH0355814(A) 申请公布日期 1991.03.11
申请号 JP19890192986 申请日期 1989.07.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MIYAMOTO YASUHIKO;SAEKI CHIHIRO
分类号 H01G4/252;H01G4/18;H01G4/30;H01G13/00;H05K3/34 主分类号 H01G4/252
代理机构 代理人
主权项
地址