| 摘要 |
<p>PURPOSE:To prevent the generation of cracks and cutting off when a finger lead is sufficiently bent, by moving a thermocompression bonding head and a bonding stand relatively downward with respect to a carrier tape, while heat inertia at the time of thermocompression bonding of the finger lead and a bump electrode is present. CONSTITUTION:A finger lead 18 composed of copper or copper ally on a carrier tape 16 is bonded to a bump electrode 14 on an IC chip 2 mounted on a bonding stand 11, by themocompression bonding, with a thermocompression bonding head 19. While the heat inertia at the time of thermocompression bonding is present, the thermocompression bonding head 19 and the bonding stand 11 are moved relatively downward with respect to the carrier tape, thereby bending the finger lead 18. Since the finger lead is bent in the state that the heat inertia at the time of thermocompression bonding is present, the finger lead is easy to stretch as compared with the case of normal temperature. As a result, when the elongation percentage of the finger lead exceeds the limit in the case of normal temperature, cracks and cutting off are hard to generate, and therefore reliability and productivity can be improved.</p> |
