发明名称 SUBSTRATE FOR ELECTRONIC COMPONENT MOUNTING
摘要 PURPOSE:To prevent the generation of a crack in through holes, in which the heads of the conductor pins for the through holes can smoothly be inserted, and a conductor circuit by a method wherein tapered opening parts are respectively formed in the through holes of a substrate toward the sides of insertion of the conductor pins. CONSTITUTION:Each through hole 1 has a tapered opening part 11 to open widely outward on the side to insert a conductor pin 2 in the hole 1 and each conductor pin 2 has a tapered flange part 22 to come into contact to the opening part 11. In the case the pins 2 are respectively inserted in the holes 1, a pin- erection device with a multitude of the pins 2 aligned on it is aligned to the holes 1 and the pins 2 are inserted in the holes 1. The heads 21 of the pins 2 are first put in the opening parts 11 of the holes 1, then, the pins 2 come into contact to the wall surfaces of the holes, are guided and are inserted in the holes. Accordingly, the pins 2 are smoothly inserted in the holes 1, a crack is never generated in the open ends and inner walls of the holes or a conductor circuit and the generation of an internal strain in the inner walls of the holes 1 is also eliminated.
申请公布号 JPH0354847(A) 申请公布日期 1991.03.08
申请号 JP19890189817 申请日期 1989.07.21
申请人 IBIDEN CO LTD 发明人 ISACHI HIROSHI;TAKADA MASATOME
分类号 H05K1/11;H01L23/12;H01L23/50 主分类号 H05K1/11
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