| 摘要 |
A mounting structure for a chip has a substrate having electrodes on an upper surface, terminals on a lower surface, and wirings to connect the electrodes and the terminals inside the substrate, pins on the upper surface of the substrate, and an integrated circuit chip with flexible lead terminals, which are interconnected to the electrodes, around a lower surface, and a heat radiation plate having openings in which the pins are received in one-to-one correspondence. The plate makes contact with an upper surface of the chip by a good heat-conductive material and is fixed to the pins by an adhesive. The substrate may be a multilayer ceramic section having wirings whose major component is gold; the ceramic section may be made of an inorganic composition which can be sintered in air at a temperature of less than 1400 DEG C. |
