| 摘要 |
PURPOSE:To prevent collision of a component holding head by providing a high pressure air injection nozzle in a direction crossing a component mounting direction, and inclining remotely the mounted component near a mounting position. CONSTITUTION:In a case where leads 3a of an electronic component 3 are inserted to mounting holes 5b of a board 2, if a component 4 is already mounted in a mounting hole 4a near it, high pressure air 17 is injected from a nozzle hole 15b to the mounted component 4 perpendicularly to a component mounting direction to remotely incline it, thereby preventing the collision of a component placing head 11. According to the structure, the yield of the component mounting is improved, and a disposing density on a circuit board can be remarkable increased. The bending amount, shape of the lead of the component can be arbitrarily set without depending upon the state of the component. |
