| 摘要 |
PURPOSE:To improve the bondability of a wire bonding by a method wherein reducing gas for sealing or inert gas is made to flow through the interior and/or the outer peripheral part of a capillary along a metal wire and the wire is sealed. CONSTITUTION:A copper wire is used as a bonding wire 1 and reducing gas of Ar+10% H2 is used as sealing gas. The above gas is introduced in the interior of a capillary 3 and the sealing gas is made to inject through the point part of the capillary along the wire. Moreover, a conduit made of a Teflon is wound on the periphery of the capillary 3, the sealing gas is made to pass through the gap between the capillary and the conduit, the gas is made to inject through the point part of the capillary along the wire. In an atmosphere 5 containing this gas, a high voltage is applied to the wire and a discharge electrode and an arc is formed, whereby heat is imparted to the point of the wire and a ball part 2 is formed. After the formation of the ball part 2, the ball part 2 is thermally fixed by pressure to an Al electrode on a semiconductor chip using a capillary chip 3. |
