| 摘要 |
<p>PURPOSE:To enable a required wiring resistance to be provided to an optional wiring point without changing a metallized wiring group pattern by a method wherein metallized materials different in specific resistance are printed using different printing patterns respectively, which are concurrently burned on the same plane or the same board. CONSTITUTION:A metallized wiring group 2 is formed on the same plane of a ceramic multilayer wiring board 1 extending outward from a rectangular blank 10. The metallized wiring group 2 is composed of a single wiring 21 of a metallized material 21a low in specific resistance, a single wiring 22 of a metallized material 22a high in specific resistance, a joint wiring 23 composed of a long metallized material 21a and a short metallized material 22a, and a joint wiring 24 composed of a short metallized material 21a and a long metallized material 22a. The metallized materials 21a and 22a are primarily formed of high melting point metal such as tungsten or molybdenum and printed using different printing patterns respectively, so that a required wiring resistance can be obtained at an optional wiring point without changing a final wiring group pattern or a wiring area by optionally selecting the overlapping point of these printing patterns.</p> |
