发明名称 COMPOUND ELECTRONIC CIRCUIT DEVICE INCLUDING INDUCTANCE ELEMENT
摘要 PURPOSE:To enable the compactness and low cost of a device and the improvement of reliability by a method wherein a part of the magnetic core of an inductance element is utilized as a mounting substrate for electronic parts. CONSTITUTION:A nearly square-shaped pot type magnetic core 1 is provided with a round groove 1A opened toward the lower part. Furthermore, a projected section 1B is provided at the central part to mount a coil 2. Next, the round groove !A is covered with a flat-plate shaped magnetic core 3 and furthermore, an insulating layer 6 having wiring patterns 5 is fixed to the opposite side of the magnetic core 3. Electronic parts 4 and plate-shaped lead wires 8 are installed at the wiring patterns 5 for connection by soldering. In additon, holes 7, 7 connected to the outside are provided at the upper wall face of the round groove 1A of the magnetic core 1 through the insulating layer 6 and the terminals 2A, 2A of the coil 2 are inserted in the holes 7, 7 for lead out. Then, the terminals 2A, 2A are connected to the suitable places of the wiring patterns 5 by soldering or the like. In this way, the compactness of the device can be realized and easy manufacture also contributes to low cost and incorporation of an inductance element having high characteristics is parmitted to improve reliability.
申请公布号 JPS57164511(A) 申请公布日期 1982.10.09
申请号 JP19810049209 申请日期 1981.04.01
申请人 TOKYO DENKI KAGAKU KOGYO KK 发明人 KOBAYASHI OSAMU
分类号 H01F27/06;H01F27/00;H01F27/29 主分类号 H01F27/06
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