| 摘要 |
PURPOSE:To house a cell in an equipment, to improve an equipment in reliability attendant on the integration of an element and a circuit into one piece, and to make the equipment lightweight and small in size by a method wherein a full solid-state secondary cell is laminated inside a printed wiring board into one piece. CONSTITUTION:Copper foil electrodes 2 and 6 are formed of a copper plated laminated board through etching, a non-through-hole is provided, the lower opening of the hole is closed with a copper plate electrode 7, a paste 5 of negative electrode material formed of copper powder into which conductive organic high molecules are mixed, a paste 6 whose base material is solid electrolyte such as Rb4Cu16I6.75Cl13.25, and a paste 3 of positive electrode material whose base material is composite oxide composed of VI a transition metal and vanadium are successively laminated on the copper plate electrode 7 (inside through- hole), and the upper opening is covered with a copper plate electrode 1, whereby a laminated printed wiring board provided with a set of a full solid-state cell layer can be formed. |
