Nickel based high temp. solder - contains molybdenum to raise soldering temp. or reduce metalloid content and improve corrosion resistance

摘要

Ni-based solder for high temperature soldering contains in at% 55-15 Mo; 0-12Si; 0-19B; 0-22P; 0-25 Cr,Fe and/or Co; 0-5 Mn,Cu,Nb,Zr and/or Ti; balance Ni. The total of B+P+Si, is 12-24. USE/ADVANTAGE: Used for soldering steel and Ni super alloys. The solder has a high liquidus temp and a small difference between liquid:us and solidus temps which makes it ideal for soldering thin components such as foil. The Mo content increases the soldering temp with an unchanged metallised content or maintains the same soldering temperature whilst lowering the metallised content which improves the corrosion resistant properties of the solder joint