Carrier plate with soft-soldered circuit substrate - has spacing wires of approximately same coefft. of thermal expansion as solder to limit loading of substrate

摘要

The carrier plate (1A) has a solderable surface which lies parallel to at least one substrate (2A, 2B), again with a surface which can be soldered, separated by a capillary gap filled with a soft solder and spacing material fixing its size and spread sparingly over the two surfaces. The spacing material (3A, 3B) is in the form of wires, lying in parallel lines on the surface and bonded to it. ADVANTAGE - Thickness of layer of solder can be maintained at definite level without expensive equipment.