发明名称 |
INTEGRATED CIRCUIT SUBSTRATE PRODUCT |
摘要 |
An integrated circuit substrate product comprising in combination: a member having an essentially planar surface area (15), said member having a supporting region (1), and serially respectively between said supporting region (1) and said surface (15), a layer (2) of device quality monocrystalline material of a semiconductor having erosion termination capability (8) and being epitaxial with said supporting region (1), a stop layer (11) of a monocrystalline material capable of terminating at least an erosion operation to which said semiconductor is responsive epitaxial with said device layer (2), and an epitaxial regrowth enabling layer (9) of said semiconductor material epitaxial with said device layer (2) and including an epitaxial stop layer (14). |
申请公布号 |
EP0287793(A3) |
申请公布日期 |
1991.03.06 |
申请号 |
EP19880103611 |
申请日期 |
1988.03.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
KIRCHNER, PETER D.;WARREN, ALAN C.;WOODALL, JERRY M. |
分类号 |
H01L21/302;H01L21/20;H01L21/306;H01L21/3065;H01L21/337;H01L21/338;H01L21/86;H01L29/43;H01L29/778;H01L29/812;(IPC1-7):H01L21/00;H01L21/84 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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