Superconducting interconnection apparatus.

摘要

A structure connecting superconductor transmission lines to integrated circuits comprises a plurality of interconnection substrates having superconducting transmission path deposited thereon in contact with metallic contact areas, and integrated circuit chip carrier substrates for mounting integrated circuits and having metallic contact areas. The substrates are mounted in a retainer structure and are separated by spacers which have apertures in registration with the contact areas. Contact devices are selectively inserted in the apertures to establish an interconnection pattern between the substrates. The retainer structure applies force to the substrates to assure physical contact between the substrates and the contact device. The structure may be assembled and disassembled for replacement of parts or reconfiguration of interconnections, without the application of heat or other processes which are incompatible with relatively brittle and heat sensitive superconducting materials. The complete structure may be submerged in a bath of liquid nitrogen for cooling. The space provided by the spacers allows for access by the cooling liquid to the superconducing material on the substrates.