| 摘要 |
<p>PURPOSE:To make it possible to align the position of an orientation flat accurately by handling a wafer with a conveying arm, rotating a rotating roller, aligning the position of the wafer, and thereafter correcting the inclination of the wafer by the advancing driving of a plurality of pins. CONSTITUTION:A wafer 10 is rotatably supported with a pair of chuck parts 32. Thereafter, the wafer 10 is set in the inclined or upright state by the driving of a turning and driving part. Then, the peripheral side edge or the wafer 10 comes into contact with a rotating roller 52 bv the dead weight or the wafer. Thereafter, the rotating roller 52 is driven. Then, the wafer 10 is driven and rotated in one direction by the frictional contact with the peripheral edge of the wafer 10. When an orientation flat part 10a is set at a position approximately facing the rotating roller 52, the driven rotation or the wafer 10 is stopped. Thereafter, a plurality of pins 60 are driven to advance. All or a plurality of the pins 60 are brought into contact with the orientation flat of the wafer 10, and the inclination of the orientation flat is corrected. Thus, the orientation flat of the wafer 10 can be accurately aligned.</p> |
