| 摘要 |
PURPOSE:To prevent the occurrence of defective connections by pushing the inner lead of each lead to a bonding table before a capillary with a lead pusher which is not in contact with a chip and a lead frame when a piece of wire is connected to the lead. CONSTITUTION:A capillary 14 is moved up and down when wires 13 are connected to the pads and leads 4 of a semiconductor chip 1. A lead pusher 25 is moved up and down when the lead 4 and the wire 13 are connected. The pusher 25 pushes the lead 4 before the capillary 14. A wire 7 is connected to the lead 4. At this time, the outer part of the lead 4 which is located outside from the wire connecting part of the lead 4 is pushed and fixed to a bonding table 11 with the lead pusher 25. By this method, the lead 4 when it is connected to the wire is not floated, and sure connection can be achieved. |
