| 摘要 |
<p>PURPOSE:To prevent a semiconductor from splitting, cracking, by providing slits to a circuit board near a semiconductor element placing region. CONSTITUTION:Slits 18 are formed around a sealing frame 15 at a reinforcing plate 13. Accordingly, even if a circuit board 11 is bent by an external force F the slits 18 formed at the plate 13 are weakened at thier rigidity as compared with the other part, and stresses are concentrated thereat. Thus, the bending shaped of the board 11 has a large deformation amount near the slits but a small deformation amount at the region which places a semiconductor element 4, and a force applied to the element 4 becomes very small. In this manner, it can prevent the element 4 from cracking, splitting, etc.</p> |
